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MIL-STD-883L 3.3.6   •   Pull Stength: MIL-STD-883K TM2038   •     Reflow Temperature  •     Cryo Questionnaire   •   Column Questionnaire
 
Some applications, including Quantum Computers, perform better at cryogenic temperatures, below what is known as the superconductivity point. This is because electrical resistance drops to zero when certain materials become superconductive, allowing current to flow without energy loss. Our series of cryogenic solder columns are made of specific materials that perform reliably at cryogenic temperatures for deep space and Lunar landings. Cryogenic solder columns reduce stress and strain caused by CTE mismatch when connecting large chip modules to PC Boards. In addition, materials can withstand fracturing caused by ductile to brittle transistion temperatures (DBTT) at extremely low temperatures. Next Generation solder columns. TopLine offers a wide range solder columns to meet your cryogenic needs. The tables below are just a small example of the column sizes we offer. Contact TopLine to discuss your specific needs.
 
With Lead (Pb) and Lead-Free Columns (RoHS)
Braided columns are available with Lead for Aerospace & Defense applications or Lead Free for RoHS AI Datacenters. Columns replace solder balls on ceramic substrates and Organic chip packages.
 
Why Columns?
Braided Solder Columns are non-collapsible, robust and compliant structures. Use for reducing stress caused by CTE mismatch. Columns are more reliable that solder balls when connecting large size chip packages to PC Boards operating in cryogenic environments. CTE mismatch (Coefficient of Thermal Expansion) puts stress on the interconnections over wide temperature cycles. The CTE of a ceramic alumina Al2O3 IC package is about 6.7ppm/°C. The CTE of organic copper clad boards is more than 17.5ppm/°C. Therefore, the amount of CTE mismatch between ceramic materials and organic boards is roughly 10ppm/°C. The corners of a large 50x50mm ceramic package might twist as much as ±70µm (±2.7mils) over temperature swings of 100°C. Eventually, the connections between the chip package and board will break over time. Solder columns are compliant and absorb CTE mismatch, thereby lengthening the life of the system.
 
More Details
A wide selection of material sets are available. Tin-Lead for Mil/Aerospace: Pb80/Sn20 and Pb90/Sn10. Columns for Quantum Computers are constructed of Indium-Niobium Alloys. Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.Road map solder columns for Quantum Computers.
 
 
Braided Solder Column Part Number Table
Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Core
Material
Solder
Core
Ø Diameter
Braid (W)
Ø Diameter
Copper
Nbr
Strands
Part Number Drawing Operating
Temperature
Ø 0.25mm
(Ø 0.010")
1.27mm
(0.050")
Lead Free Ø 0.15mm
(Ø 0.006")
0.025mm
(1.0 mil)
16X BC10H10x50A 951050 -55°C +125°C
Pb80/Sn20 Ø 0.15mm
(Ø 0.006")
0.025mm
(1.0 mil)
16X BC8020B10x50A 751050 -140°C +150°C
Pb90/Sn10 Ø 0.15mm
(Ø 0.006")
0.025mm
(1.0 mil)
16X BC9010B10x50A 711050 -180°C +150°C
HMP Pb93.5 Ø 0.15mm
(Ø 0.006")
0.025mm
(1.0 mil)
16X BC935M10x50A 761050 -180°C +204°C
Ø 0.30mm
(Ø 0.012")
1.60mm
(0.063")
Lead Free Ø 0.20mm
(Ø 0.008")
0.025mm
(1.0 mil)
16X BC10H12x63A 951263 -55°C +125°C
Pb80/Sn20 Ø 0.20mm
(Ø 0.008")
0.025mm
(1.0 mil)
16X BC8020B12x63A 751263 -140°C +150°C
Pb90/Sn10 Ø 0.20mm
(Ø 0.008")
0.025mm
(1.0 mil)
16X BC9010B12x63A 711263 -180°C +150°C
HMP Pb93.5 Ø 0.20mm
(Ø 0.008")
0.025mm
(1.0 mil)
16X BC935M12x63A 761263 -180°C +204°C
Ø 0.35mm
(Ø 0.014")
1.90mm
(0.075")
Lead Free Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC10H14x75A 951475 -55°C +125°C
Pb80/Sn20 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC8020B14x75A 751475 -140°C +150°C
Pb90/Sn10 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC9010B14x75A 711475 -180°C +150°C
In90/Ag10 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC90N14x75A 111475 -273°C +120°C
In97/Ag3 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC97T14x75A 131487 -273°C +120°C
In100 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC100T14x75A 101475 -273°C +120°C
In70/Pb30 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC70N14x75A 701475 -273°C +150°C
HMP Pb93.5 Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
16X BC935M14x75A 761475 -180°C +204°C
Ø 0.40mm
(Ø 0.016")
2.21mm
(0.087")
Lead Free Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC10H16x87B 951687 -55°C +125°C
Pb80/Sn20 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC8020B16x87B 751687 -140°C +150°C
Pb90/Sn10 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC9010B16x87B 711687 -180°C +150°C
In90/Ag10 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC90N16x87B 111687 -273°C +120°C
In97/Ag3 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC97T16x87B 131687 -273°C +120°C
In100 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC100T16x87B 101687 -273°C +120°C
In70/Pb30 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC70N16x87B 701687 -273°C +150°C
HMP Pb93.5 Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC935M16x87B 761675 -180°C +204°C
Ø 0.45mm
(Ø 0.018")
2.21mm
(0.087")
Lead Free Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC10H18x87B 951887 -55°C +125°C
Pb80/Sn20 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC8020B18x87B 751887 -140°C +150°C
Pb90/Sn10 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC9010B18x87B 711887 -180°C +150°C
In90/Ag10 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC90N18x87B 111887 -273°C +120°C
In97/Ag3 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC97T18x87B 131887 -273°C +120°C
In100 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC100T18x87B 101887 -273°C +120°C
In70/Pb30 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC70N18x87B 702087 -273°C +150°C
HMP Pb93.5 Ø 0.30mm
(Ø 0.012")
0.038mm
(1.5 mil)
16X BC935M18x87B 761887 -180°C +204°C
Ø 0.50mm
(Ø 0.020")
2.21mm
(0.087")
Lead Free Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC10H20x87B 952087 -55°C +125°C
Pb80/Sn20 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC8020B20x87B 752087 -140°C +150°C
Pb90/Sn10 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC9010B20x87B 712087 -180°C +150°C
In90/Ag10 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC90N20x87B 112087 -273°C +120°C
In97/Ag3 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC97T20x87B 132087 -273°C +120°C
In100 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC100T20x87B 102087 -273°C +120°C
In70/Pb30 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC70N20x87B 702087 -273°C +150°C
HMP Pb93.5 Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC935M20x87B 762087 -180°C +204°C
Note 1: Contact TopLine for other ØDiameter and Length available.
Note 2: Applications: RoHS AI Datacenters , Aerospace & Defense , Cryogenic , Quantum Superconducting , Downhole Elevated Temperature
 
 
Outline Drawings
Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5
Braided Column
After Coating
Section View
Before Coating
Detail Solder Column
Before Coating
Column Length
Before and After
Trimming (Planarization)
Column Length
L = Column Length as Delivered
L2 = After Trimming (Planarization)
 
 
 
Column Part Number System
 
    BC         9010         B         14         X         75         A    
Column Type Core Alloy Coating Ø Diameter
Mils
Packaging Length
Mils
Option
BC = Braided Column

Other Columns
Tin-Lead SnPb:
8020 = Pb80/Sn20
9010 = Pb90/Sn10
935 = HMP Pb93.5/Sn5


Lead Free (RoHS):
5 = Sn95/Sb5
8 = Sn91.5/Sb8.5
10 = Sn90/Sb10


Indium Alloy:
100 = Indium (In100)
97 = Indium/Silver (In97/Ag3)
90 = Indium/Silver (In90/Ag10)
70 = Indium/Lead (In70/Pb30)



Patents Granted:
U.S. Patent 10,477,698
CN Patent 111,822,899

Indium-Niobium Pat. Pending

Tin-Lead
B = Sn63/Pb37 16*Cu

L = Sn63/Pb37 8*Cu
M = Pb80/Sn20 16*Cu

Lead-Free (RoHS)
H = SAC+In 16*Cu

J = SAC+In 8*Cu

Cryogenic
N = In97/Ag3
Q = In100
T = In52/Sn48
Ø Diameter
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
9 = 0.23mm
10 = 0.25mm
11 = 0.28mm
12 = 0.30mm
13 = 0.33mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
20 = 0.50mm
22 = 0.56mm
35 = 0.89mm

Other Diameter Available
Standard:
X = Jar


Special:
J = JEDEC Tray
T = 4" Tray
W = 2" Tray
E = Tape & Reel
Length
25 = 0.63mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
100 = 2.54mm


Other Length Available
Options: A to Z


Cyrogenic:
C172 Soft
A= 1.0mil
B= 1.5mil
C= 2.0mil


Superconducting:
Nb Niobium
M= 1.0mil
N= 1.5mil
R= 2.0mil


C172 Hard
D= 1.0mil
E= 1.5mil
F= 2.0mil


Cu-Pd (PCC)
G= 1.5mil
H= 2.0mil


Au Gold
J= 1.5mil
K= 2.0mil


 
 
Column DP# Order Number
 
    7         14         75         0    
Column Type Ø Diameter
Mils
Length
Mils
Package
Quantity
Braided Column (BC) 16X:
4 = C172 Braid + Pb80/Sn20 Solder (B)
5 = C172 Braid + Lead Free Solder (H)
7 = C172 Braid + Pb90/Sn10 Solder (B)



Other Columns:
Code • Diameter
06 = Ø0.15mm
08 = Ø0.20mm
09 = Ø0.23mm
10 = Ø0.25mm
11 = Ø0.28mm
12 = Ø0.30mm
13 = Ø0.33mm
14 = Ø0.35mm
15 = Ø0.38mm
16 = Ø0.40mm
17 = Ø0.43mm
18 = Ø0.45mm
20 = Ø0.50mm
22 = Ø0.56mm
30 = Ø0.75mm
35 = Ø0.89mm
Code   •  Length
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
99 = 2.54mm


Other Lengths Available
Code   •  Qty
0 = Jar 100pcs
1 = Jar 1Kpcs
2 = Jar 5Kpcs
3 = Jar 10Kpcs
7 = Reel 2500pcs
8 = Tray
9 = Bulk
 
 
Column Drawing Number
 
    71         14         75    
Column Type and Plating Ø Diameter
Mils
Length
Mils
Braided Column (BC)

Lead Free (RoHS)
Code   Core Alloy   Braid   Part#
95   Sn90/Sb10   16x (BC10H)
97     Sn95/Sb5     16x (BC5H)
98   Sn91.5/Sb8.5   16x (BC8H)
94    Sn90/Sb10    8x (BC10J)
96     Sn95/Sb5     8x (BC5J)


Leaded Core
Code   Core Alloy   Braid   Part#
70     In70/Pb30     16x     (BC70N)
71     Pb90/Sn10   16x     (BC9010B)
75     Pb80/Sn20     16x     (BC8020B)
76     HMP Pb93.5     16x     (BC935M)
72     Pb90/Sn10     32x     (BC9010D)
73     Pb90/Sn10     8x     (BC9010L)
74     Pb80/Sn20     8x     (BC8020L)


Indium Core
Code   Core Alloy   Braid   Part#
10       In100         16x       (BC100T)
11     In90/Ag10     16x     (BC90N)
13       In97/Ag3     16x     (BC97T)
70     In70/Pb30     16x     (BC70N)



Application Specific (ASIC)
89 = Customer Specific Assigned number

Other Columns:
  Diameter  
06 = Ø0.15mm
08 = Ø0.20mm
09 = Ø0.23mm
10 = Ø0.25mm
11 = Ø0.28mm
12 = Ø0.30mm
13 = Ø0.33mm
14 = Ø0.35mm
15 = Ø0.38mm
16 = Ø0.40mm
17 = Ø0.43mm
18 = Ø0.45mm
20 = Ø0.50mm
22 = Ø0.56mm
27 = Ø0.70mm
30 = Ø0.75mm
35 = Ø0.89mm

Other Ø Diameter Available
  Length  
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
99 = 2.54mm

Other Lengths Available
 
 
U.S. PATENT 10,477,698  •   CN Patent  111,822,899  •   More About
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
HS Code: 8311.30.3000 Lead-Tin Solders
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
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